"Moore's Law Dead by 2022" - Then, Before or .... ? The following chart from Samsung clearly illustrates this dynamics for NAND, but from the above discussion it may be even more true for SoC.
NAND cell structure
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MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology
IEDM 2012 - The Pivotal Point for Monolithic 3D IC, http://www.monolithic3d.com/2/post/2013/01/iedm-2012-the-pivotal-point-for-monolithic-3d-ic.html#
The monolithic 3D IC technology is applied to produce monolithically stacked high performance High-k Metal Gate (HKMG) devices, the world’s most advanced production transistors.
The monolithic 3D IC technology is applied to producing monolithically stacked low leakage Recessed ChAnnel Transistors (RCATs), commonly used in DRAM chips since the 90nm node.
"Continuous Innovation Enables Continuation of Moore's Law" explained in this blog piece: http://www.monolithic3d.com/2/post/2012/06/is-the-cost-reduction-associated-with-scaling-over.html
The most common area that you asked us was about low temperature (less than 400°C) bonding and low temperature cleaving processes