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NAND cell structure

NAND cell structure

SEMICON West 2012 exhibits preview: Lithography focus - ElectroIQ

SEMICON West 2012 exhibits preview: Lithography focus - ElectroIQ

It is amazing that after so many years of development and efforts and great presentations we are still not in a full production and still basic R as well as EDA still in infancy.

It is amazing that after so many years of development and efforts and great presentations we are still not in a full production and still basic R as well as EDA still in infancy.

"Moore's Law Dead by 2022" - Then, Before or .... ? The following chart from Samsung clearly illustrates this dynamics for NAND, but from the above discussion it may be even more true for SoC.

"Moore's Law Dead by 2022" - Then, Before or .... ? The following chart from Samsung clearly illustrates this dynamics for NAND, but from the above discussion it may be even more true for SoC.

Win the New iPad with Retina Display. Patomate - Free Software. www.patomate.com

Win the New iPad with Retina Display. Patomate - Free Software. www.patomate.com

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology

MonolithIC 3D Inc. Granted its 30th Patent on 3D IC Technology

IEDM 2012 - The Pivotal Point for Monolithic 3D IC, http://www.monolithic3d.com/2/post/2013/01/iedm-2012-the-pivotal-point-for-monolithic-3d-ic.html#

IEDM 2012 - The Pivotal Point for Monolithic 3D IC, http://www.monolithic3d.com/2/post/2013/01/iedm-2012-the-pivotal-point-for-monolithic-3d-ic.html#

Focus on monolithic 3D-ICs paradigm shift for semicon industry

Focus on monolithic 3D-ICs paradigm shift for semicon industry

The monolithic 3D IC technology is applied to produce monolithically stacked high performance High-k Metal Gate (HKMG) devices, the world’s most advanced production transistors.

The monolithic 3D IC technology is applied to produce monolithically stacked high performance High-k Metal Gate (HKMG) devices, the world’s most advanced production transistors.

The monolithic 3D IC technology is applied to producing monolithically stacked low leakage Recessed ChAnnel Transistors (RCATs), commonly used in DRAM chips since the 90nm node.

The monolithic 3D IC technology is applied to producing monolithically stacked low leakage Recessed ChAnnel Transistors (RCATs), commonly used in DRAM chips since the 90nm node.


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Last time we discussed three-dimensional FPGAs, it became clear that there are two major areas that block wider acceptance of current 2D FPGAs: their relative inefficiency in area (i.e., cost) power and performance as compared to ASICs, and the limited number of sizes that are offered by vendors due to the high cost associated with each family member.

Last time we discussed three-dimensional FPGAs, it became clear that there are two major areas that block wider acceptance of current 2D FPGAs: their relative inefficiency in area (i.e., cost) power and performance as compared to ASICs, and the limited number of sizes that are offered by vendors due to the high cost associated with each family member.

It is amazing that after so many years of development and efforts and great presentations we are still not in a full production and still basic R as well as EDA still in infancy.

It is amazing that after so many years of development and efforts and great presentations we are still not in a full production and still basic R as well as EDA still in infancy.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Finalist for EETimes’ Innovator of the Year Award. In recognition of his contributions to monolithic 3D-ICs.

Zvi Or-Bach, CEO of MonolithIC 3D Inc., selected as Finalist for EETimes’ Innovator of the Year Award. In recognition of his contributions to monolithic 3D-ICs.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display  Startup now has 10 issued patents and 50 pending patents in the field of 3D-ICs.

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display Startup now has 10 issued patents and 50 pending patents in the field of 3D-ICs.

Recently I read a very uncommon report title: "NVIDIA deeply unhappy with TSMC, claims 20nm essentially worthless". Quoting directly: “One of the unspoken rules of customer-foundry relations is that you virtually never see the former speak poorly of the latter. Only when things have seriously hit the fan do partners like AMD or NVIDIA admit to manufacturing problems... That’s why we were surprised - and our source testified to being stunned"

Recently I read a very uncommon report title: "NVIDIA deeply unhappy with TSMC, claims 20nm essentially worthless". Quoting directly: “One of the unspoken rules of customer-foundry relations is that you virtually never see the former speak poorly of the latter. Only when things have seriously hit the fan do partners like AMD or NVIDIA admit to manufacturing problems... That’s why we were surprised - and our source testified to being stunned"

The Future is the Interconnect: IITC

The Future is the Interconnect: IITC

Silicon Image launches new subsidiary to focus on Internet of Everything services | Solid State Technology

Silicon Image launches new subsidiary to focus on Internet of Everything services | Solid State Technology

IntSim is an open-source CAD tool to simulate 2D and 3D-ICs.

IntSim is an open-source CAD tool to simulate 2D and 3D-ICs.

latest very addictive games

latest very addictive games

Sony PlayStation 4 Camera (PS4)

Sony PlayStation 4 Camera (PS4)

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